Welcome
de
Intel
AGFB006R24C3E3E
System On Chip (SoC)
AGFB006R24C3E3E
6-AGFB006R24C3E3E
IC FPGA AGILEX-F 2340FBGA
In Stock : Please Submit RFQ TO US
Not available
QUICK RFQ
ADD TO RFQ LIST
AGFB006R24C3E3E Description
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 573K Logic Elements 1.4GHz
Tech Specifications
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
576
Peripherals
DMA, WDT
Product Status
Active
Supplier Device Package
-
Series
Agilex F
Package / Case
-
Mfr
Intel
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package
Tray
Primary Attributes
FPGA - 573K Logic Elements
Moisture Sensitivity Level (MSL)
3 (168 Hours)
AGFB006R24C3E3E Documents
Download datasheets AGFB006R24C3E3E
Related Parts
M2S025TS-1FCSG325
Microchip Technology
R8J66607B00FP#RF1S
Renesas Electronics America Inc
AGFB014R24C2E3VAA
Intel
BCM1480B0K800
Broadcom
MPFS025TS-FCVG484I
Microchip Technology
M2S100S-1FC1152I
Microsemi
AGFA008R24C3E3E
Intel
M2S025TS-1FG484I
Microchip Technology
AGFB027R24C2I1V
Intel
AGFA027R24C2E3VR2
Intel
5ASXFB5H4F40I3NCZ
Intel
XC7Z020-1CLG484C
AMD
MPFS095TLS-FCVG784I
Microchip Technology
M2S050T-1VF400
Microchip Technology
Shopping Guide
Payment Methods
Payment_desc
Shipping Rate
Shipping_rate_desc
Delivery Methods
Delivery_Methods_desc
Home_foot.INFORMATION
Home_foot.POLICIES
Home_foot.TOOLS
Home_foot.payment
Home_foot.Transportation
Home_foot.Trademark
Home_foot.Copyright