Renesas Electronics Corporation_DF3067RVF13V
Renesas Electronics Corporation_DF3067RVF13V
Renesas Electronics Corporation

DF3067RVF13V

Microcontrollers
DF3067RVF13V
4-DF3067RVF13V
HD64F3067 - Microcontroller, 16-
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DF3067RVF13V Description

Tech Specifications

Mfr
Renesas
Series
H8® H8/300H
Package
Bulk
Core Processor
H8/300H
Program Memory Type
FLASH
RAM Size
4K x 8
Number of I/O
70
Operating Temperature
-20°C ~ 75°C (TA)
Mounting Type
Surface Mount
Package / Case
100-BFQFP
Supplier Device Package
100-QFP (14x14)
Speed
13MHz
Core Size
16-Bit
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Program Memory Size
128KB (128K x 8)
Voltage - Supply (Vcc/Vdd)
3V ~ 5.5V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal

DF3067RVF13V Documents

Download datasheets DF3067RVF13V

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