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NXP Semiconductors_LPC55S69JBD100K
NXP Semiconductors_LPC55S69JBD100K
NXP Semiconductors

LPC55S69JBD100K  

Microcontrollers
NXP Semiconductors
LPC55S69JBD100K
4-LPC55S69JBD100K
NXP Semiconductors-LPC55S69JBD100K-datasheet-256544.pdf
NXP Semiconductors-LPC55S69JBD100K-datasheets-256544.pdf
LPC55xx - High Efficiency Arm??
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    Description Tech Specifications Documents Shopping Guide

    LPC55S69JBD100K Description

    LPC55S6x Series, ARM® Cortex®-M33, 100-HLQFP (14x14), ROHS3 Compliant

    Tech Specifications

    Core Processor
    ARM® Cortex®-M33
    Program Memory Type
    FLASH
    Product Status
    Active
    Supplier Device Package
    100-HLQFP (14x14)
    EEPROM Size
    -
    Package / Case
    100-LQFP Exposed Pad
    REACH Status
    REACH Unaffected
    Mfr
    NXP USA Inc.
    Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
    RoHS Status
    ROHS3 Compliant
    Moisture Sensitivity Level (MSL)
    3 (168 Hours)
    Speed
    150MHz
    Operating Temperature
    -40°C ~ 105°C (TA)
    RAM Size
    320K x 8
    ECCN
    5A992C
    Number of I/O
    64
    Peripherals
    Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
    Mounting Type
    Surface Mount
    Oscillator Type
    Internal
    Series
    LPC55S6x
    Core Size
    32-Bit Single-Core
    Connectivity
    Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
    Program Memory Size
    640KB (640K x 8)
    HTSUS
    8542.31.0001
    Package
    Tray
    Data Converters
    A/D 10x16b
    Base Product Number
    LPC55S69

    LPC55S69JBD100K Documents

    Download datasheets LPC55S69JBD100K

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