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NXP Semiconductors
MCF54455CVP200
Microcontrollers
MCF54455CVP200
4-MCF54455CVP200
IC MCU 32BIT ROMLESS 360BGA
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MCF54455CVP200 Description
MCF5445x Series, Coldfire V4, 360-BGA (23x23)
Tech Specifications
Mfr
NXP USA Inc.
Series
MCF5445x
Package
Tray
Core Processor
Coldfire V4
Program Memory Type
ROMless
RAM Size
32K x 8
Number of I/O
132
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
360-BBGA
Supplier Device Package
360-BGA (23x23)
Base Product Number
MCF54455
Speed
200MHz
Core Size
32-Bit Single-Core
Connectivity
I²C, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, WDT
Voltage - Supply (Vcc/Vdd)
1.35V ~ 3.6V
Oscillator Type
External, Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Assembly/Origin
COO/Label 15-apr-2022
MCF54455CVP200 Documents
Download datasheets MCF54455CVP200
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