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NXP Semiconductors
MPC850DEZQ66BU
Microprocessors
MPC850DEZQ66BU
7-MPC850DEZQ66BU
IC MPU MPC8XX 66MHZ 256BGA
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MPC850DEZQ66BU Description
Tech Specifications
Mfr
NXP USA Inc.
Series
MPC8xx
Package
Tray
Core Processor
MPC8xx
Operating Temperature
0°C ~ 95°C (TA)
Mounting Type
Surface Mount
Package / Case
256-BBGA
Supplier Device Package
256-PBGA (23x23)
Base Product Number
MPC85
Voltage - I/O
3.3V
Speed
66MHz
Number of Cores/Bus Width
1 Core, 32-Bit
Co-Processors/DSP
Communications; CPM
RAM Controllers
DRAM
Graphics Acceleration
No
Ethernet
10Mbps (1)
USB
USB 1.x (1)
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Packaging
All Dev Label Update 15/Dec/2020
MPC850DEZQ66BU Documents
Download datasheets MPC850DEZQ66BU
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