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NXP Semiconductors
MPC855TCZQ66D4
Microprocessors
MPC855TCZQ66D4
7-MPC855TCZQ66D4
IC MPU MPC8XX 66MHZ 357BGA
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MPC855TCZQ66D4 Description
Tech Specifications
Mfr
NXP USA Inc.
Series
MPC8xx
Package
Tray
Core Processor
MPC8xx
Operating Temperature
-40°C ~ 95°C (TA)
Mounting Type
Surface Mount
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Base Product Number
MPC85
Voltage - I/O
3.3V
Speed
66MHz
Number of Cores/Bus Width
1 Core, 32-Bit
Co-Processors/DSP
Communications; CPM
RAM Controllers
DRAM
Graphics Acceleration
No
Ethernet
10Mbps (1), 10/100Mbps (1)
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Obsolescence/ EOL
Mult Dev EOL 26/Sep/2020
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020
MPC855TCZQ66D4 Documents
Download datasheets MPC855TCZQ66D4
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