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Renesas Electronics America Inc
R9A06G037GNP#AA0
System On Chip (SoC)
R9A06G037GNP#AA0
6-R9A06G037GNP#AA0
SOC PLC MODEM LSI SMART GRID ASS
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R9A06G037GNP#AA0 Description
ARM® Cortex®-M3, 64-HVQFN (9x9)
Tech Specifications
Mfr
Renesas Electronics America Inc
Package
Tray
Core Processor
ARM® Cortex®-M3
RAM Size
128KB
Number of I/O
16
Operating Temperature
-40°C ~ 85°C (TA)
Package / Case
64-VFQFN Exposed Pad
Supplier Device Package
64-HVQFN (9x9)
Speed
138MHz
Connectivity
CSI, I²C, UART
Peripherals
PWM
Architecture
DSP, MCU
R9A06G037GNP#AA0 Documents
Download datasheets R9A06G037GNP#AA0
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