Epson_S1C17F57D00E200
Epson_S1C17F57D00E200
Epson

S1C17F57D00E200

Microcontrollers
Epson
S1C17F57D00E200
4-S1C17F57D00E200
IC MCU 16BIT 32KB FLASH DIE
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S1C17F57D00E200 Description

Tech Specifications

Mfr
Epson Electronics America Inc-Semiconductor Div
Package
Tape & Reel (TR)
Core Processor
S1C17
Program Memory Type
FLASH
RAM Size
2K x 8
Number of I/O
29
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
Die
Base Product Number
S1C17F57
Speed
4.2MHz
Core Size
16-Bit
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
PWM, WDT
Program Memory Size
32KB (32K x 8)
Voltage - Supply (Vcc/Vdd)
2V ~ 3.6V
Oscillator Type
Internal
Featured Product
Ticket Vending Machine

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