NXP Semiconductors_SPC5125YVN400
NXP Semiconductors_SPC5125YVN400
NXP Semiconductors

SPC5125YVN400  

Microcontrollers
NXP Semiconductors
SPC5125YVN400
4-SPC5125YVN400
IC MCU 32BIT ROMLESS 324PBGA
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SPC5125YVN400 Description

MPC51xx Series, e300, 324-PBGA (23x23)

Tech Specifications

Mfr
NXP USA Inc.
Series
MPC51xx
Package
Tray
Core Processor
e300
Program Memory Type
ROMless
RAM Size
32K x 8
Number of I/O
64
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
324-BBGA
Supplier Device Package
324-PBGA (23x23)
Base Product Number
SPC5125
Speed
400MHz
Core Size
32-Bit Single-Core
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Voltage - Supply (Vcc/Vdd)
1.08V ~ 3.6V
Oscillator Type
External
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Design/Specification
Copper Wire Update 03/Apr/2015
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020

SPC5125YVN400 Documents

Download datasheets SPC5125YVN400

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