Welcome
de
en
de
Home_head.Shop
Home_head.RFQ
Home_head.User
Home_head.Personal_Center
Home_head.Update_Password
Home_head.Logout
Home_head.Login
Home_head.Home
Home_head.All_Parts
Home_head.Manufacturer
Home_head.RFQ
Home_head.Blog
Home_head.About_Us
Home_head.Quality_Inspection
Home_head.Test_Report
Home_head.Topic
Home_head.Home
Home_head.All_Parts
Home_head.Manufacturer
Home_head.RFQ
Home_head.Blog
Home_head.About_Us
Home_head.Quality_Inspection
Home_head.Test_Report
Home_head.Topic
RFQ
Product
Microcontrollers, Microprocessor, FPGA Modules
TE0720-04-31C33MA
Trenz Electronic
TE0720-04-31C33MA
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Mfr. Part #
TE0720-04-31C33MA
Apmheo Part #
8-TE0720-04-31C33MA
Datasheet
Description:
IC SOC MODULE XILINX ZYNQ
In Stock :
4
Not available
Contact_Name
Company Name
Email
Telephone
Country_Region
No data
QUICK RFQ
ADD TO RFQ LIST
Jump to
Description
Tech Specifications
Documents
Shopping Guide
TE0720-04-31C33MA Description
ARM® Cortex®-A9
Tech Specifications
Mfr
Trenz Electronic GmbH
Package
Bulk
Core Processor
ARM® Cortex®-A9
RAM Size
1GB
Operating Temperature
0°C ~ 70°C
Speed
766MHz
Module/Board Type
Ethernet Core
Flash Size
32MB
Connector Type
Board-to-Board (BTB) Socket
Size / Dimension
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0720-04-31C33MA Documents
Download datasheets TE0720-04-31C33MA
Related Parts
MYC-Y7Z020-V2-4E512D-766-I
MYIR Tech Limited
EDM1-IMX6U-MSD-BW
Wandboard.Org
KU82360SLAHC1
Intel
SCM-20260N-C
GHI Electronics, LLC
20-101-0674
Digi
FS-3038
Digi
ME-XU1-6EG-1I-D11E-R4.2
Enclustra
TE0823-01-S002
Trenz Electronic
20-101-0446
Digi
TE0782-02-A2I33FA
Trenz Electronic
TE0712-03-81I36-A
Trenz Electronic
TE0745-02-72I11-A
Trenz Electronic
DC-ME-Y402-C
Digi
IW-G30M-C4EV-4E002G-E008G-BIA
iWave Systems
TE0820-03-3AE21FA
Trenz Electronic
SCM-20260E-B
GHI Electronics, LLC
M5485BFEE-E
Beacon EmbeddedWorks
SOMAM1808-10-1502AHCR
Beacon EmbeddedWorks
Shopping Guide
Payment Methods
Payment_desc
Shipping Rate
Shipping_rate_desc
Delivery Methods
Delivery_Methods_desc