Welcome
de
Trenz Electronic
TE0813-01-3AE11-A
Microcontrollers, Microprocessor, FPGA Modules
TE0813-01-3AE11-A
8-TE0813-01-3AE11-A
MPSOC MODULE WITH XILINX ZYNQ UL
In Stock : Please Submit RFQ TO US
Not available
QUICK RFQ
ADD TO RFQ LIST
TE0813-01-3AE11-A Description
Zynq® UltraScale+™ Embedded Module Zynq UltraScale+ XCZU3CG-1SFVC784E 2GB 128MB
Tech Specifications
Core Processor
Zynq UltraScale+ XCZU3CG-1SFVC784E
Speed
-
Operating Temperature
0°C ~ 85°C
Flash Size
128MB
RAM Size
2GB
Size / Dimension
2.990" L x 2.050" W (76.00mm x 52.00mm)
Product Status
Active
Series
Zynq® UltraScale+™
Module/Board Type
MPU Core
Co-Processor
-
Mfr
Trenz Electronic GmbH
Connector Type
Board-to-Board (BTB) Socket - 240
Package
Bulk
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
TE0813-01-3AE11-A Documents
Download datasheets TE0813-01-3AE11-A
Related Parts
CC-9C-V212-ZA-B
Digi
CC-9P-V502-MF-VS
Digi
CENGPXA270-312-10-440ECR
Beacon EmbeddedWorks
MCXL-S055BC-I
ARIES Embedded
TE0741-02-070-2CF
Trenz Electronic
TE0745-01-35-1C
Trenz Electronic
TE0741-04-D2I-1-A
Trenz Electronic
TE0782-02-92I33FH
Trenz Electronic
TE0725LP-01-72C-1U
Trenz Electronic
TE0720-03-62I320M
Trenz Electronic
SOMDM3730-30-2780AKCR
Beacon EmbeddedWorks
3358-IX-X38-RI
Critical Link
TE0813-01-4BE11-A
Trenz Electronic
EC-VA-H264-10B-30-1080-MXC-LL
SOC Technologies (System-On-Chip Technologies)
EC-VA-H264-10B-60-1080-MXC-ZL
SOC Technologies (System-On-Chip Technologies)
EZ80F915050MODG
Zilog
TE0723-03-07S-1C
Trenz Electronic
FS-355
Digi
Shopping Guide
Payment Methods
Payment_desc
Shipping Rate
Shipping_rate_desc
Delivery Methods
Delivery_Methods_desc
Home_foot.INFORMATION
Home_foot.POLICIES
Home_foot.TOOLS
Home_foot.payment
Home_foot.Transportation
Home_foot.Trademark
Home_foot.Copyright