Welcome
de
Trenz Electronic
TE0813-02-2BE81-A
Microcontrollers, Microprocessor, FPGA Modules
TE0813-02-2BE81-A
8-TE0813-02-2BE81-A
MPSOC MODULE WITH AMD ZYNQ ULTRA
In Stock : Please Submit RFQ TO US
Not available
QUICK RFQ
ADD TO RFQ LIST
TE0813-02-2BE81-A Description
Zynq UltraScale+ Embedded Module Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E 4GB 128MB
Tech Specifications
Core Processor
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Speed
-
Operating Temperature
0°C ~ 85°C
Flash Size
128MB
RAM Size
4GB
Size / Dimension
2.990" L x 2.050" W (76.00mm x 52.00mm)
Product Status
Active
Series
Zynq UltraScale+
Module/Board Type
MPU Core
Co-Processor
-
Mfr
Trenz Electronic GmbH
Connector Type
Board-to-Board (BTB) Socket - 4 x 240
Package
Bulk
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
TE0813-02-2BE81-A Documents
Download datasheets TE0813-02-2BE81-A
Related Parts
DC-ME4-01T-S-50
Digi
FS-355
Digi
101-0674
Digi
TE0782-02-045-2IC
Trenz Electronic
TE0841-02-035-1C
Trenz Electronic
M5485AFE
NXP Semiconductors
BS2E-IC
Parallax, Inc.
L138-FX-325-RC
Critical Link
CENGPXA270-416-11-505HXR
Beacon EmbeddedWorks
TE0745-02-71I11-A
Trenz Electronic
TE0712-02-82C36-P
Trenz Electronic
ME-XU9-5EV-1I-D12E-L11-R2.1
Enclustra
SM-K26-XCL2GC
AMD
TE0820-04-4AE21FA
Trenz Electronic
DLP-245PB-G
FTDI, Future Technology Devices International Ltd
CENGPXA270-416-10-550HIR
Beacon EmbeddedWorks
TE0803-02-02EG-1EA
Trenz Electronic
DC-ME-Y402-C
Digi
Shopping Guide
Payment Methods
Payment_desc
Shipping Rate
Shipping_rate_desc
Delivery Methods
Delivery_Methods_desc
Home_foot.INFORMATION
Home_foot.POLICIES
Home_foot.TOOLS
Home_foot.payment
Home_foot.Transportation
Home_foot.Trademark
Home_foot.Copyright