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Product
System On Chip (SoC)
AGFB022R31C3I3E
Intel
AGFB022R31C3I3E
System On Chip (SoC)
Manufacturer
Intel
Mfr. Part #
AGFB022R31C3I3E
Apmheo Part #
6-AGFB022R31C3I3E
Datasheet
Intel-AGFB022R31C3I3E-datasheets-137857.pdf
Description:
IC FPGA AGILEX-F 3184FBGA
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AGFB022R31C3I3E Description
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 2.2M Logic Elements 1.4GHz
Tech Specifications
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
720
Peripherals
DMA, WDT
Product Status
Active
Supplier Device Package
-
Series
Agilex F
Package / Case
-
Mfr
Intel
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package
Tray
Primary Attributes
FPGA - 2.2M Logic Elements
Moisture Sensitivity Level (MSL)
3 (168 Hours)
AGFB022R31C3I3E Documents
Download datasheets AGFB022R31C3I3E
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