NXP Semiconductors_LPC5526JBD64K
NXP Semiconductors_LPC5526JBD64K
NXP Semiconductors

LPC5526JBD64K

Microcontrollers
NXP Semiconductors
LPC5526JBD64K
4-LPC5526JBD64K
IC MCU 32BIT 256KB FLASH 64HTQFP
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LPC5526JBD64K Description

ARM® Cortex®-M33 LPC552x Microcontroller IC 32-Bit Single-Core 150MHz 256KB (256K x 8) FLASH 64-HTQFP (10x10)

Tech Specifications

Mfr
NXP USA Inc.
Series
LPC552x
Package
Tray
Core Processor
ARM® Cortex®-M33
Program Memory Type
FLASH
RAM Size
144K x 8
Number of I/O
36
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Supplier Device Package
64-HTQFP (10x10)
Base Product Number
LPC5526
Speed
150MHz
Core Size
32-Bit Single-Core
Connectivity
Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Program Memory Size
256KB (256K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 10x16b
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Design/Specification
LPC55S6x/LPC55S2x/LPC552x 22/Dec/2022
PCN Assembly/Origin
LPC55(S)6x/LPC552x 29/Aug/2022LPC55x 17/Apr/2022
PCN Packaging
5+1 Dry Pack Chg 4/May/2022LPC55- 05/Feb/2023

LPC5526JBD64K Documents

Download datasheets LPC5526JBD64K

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