NXP Semiconductors_MPC755BRX300LE
NXP Semiconductors_MPC755BRX300LE
NXP Semiconductors

MPC755BRX300LE  

Microprocessors
NXP Semiconductors
MPC755BRX300LE
7-MPC755BRX300LE
IC MPU MPC7XX 300MHZ 360CBGA
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MPC755BRX300LE Description

MPC7xx Series, PowerPC, 360-CBGA (25x25)

Tech Specifications

Mfr
NXP USA Inc.
Series
MPC7xx
Package
Tray
Core Processor
PowerPC
Operating Temperature
0°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
360-BCBGA, FCCBGA
Supplier Device Package
360-CBGA (25x25)
Base Product Number
MPC75
Voltage - I/O
2.5V, 3.3V
Speed
300MHz
Number of Cores/Bus Width
1 Core, 32-Bit
Graphics Acceleration
No
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Obsolescence/ EOL
Mult Device EOL 01/Apr/2016
PCN Design/Specification
Reference Manual Update 28/Mar/2014
PCN Packaging
All Dev Label Update 15/Dec/2020

MPC755BRX300LE Documents

Download datasheets MPC755BRX300LE

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