Welcome
de
Texas Instruments
TDA3LXRBFABFQ1
System On Chip (SoC)
TDA3LXRBFABFQ1
6-TDA3LXRBFABFQ1
LOW POWER SOC W/ PROCESSING, IMA
In Stock : Please Submit RFQ TO US
Not available
QUICK RFQ
ADD TO RFQ LIST
TDA3LXRBFABFQ1 Description
ARM® Cortex®-M4, C66x System On Chip (SOC) IC - 212.8MHz, 745MHz 367-FCBGA (15x15)
Tech Specifications
Core Processor
ARM® Cortex®-M4, C66x
Speed
212.8MHz, 745MHz
Operating Temperature
-40°C ~ 125°C (TJ)
Architecture
DSP, MPU
Flash Size
-
RAM Size
512kB
Number of I/O
126
Peripherals
DMA, POR, PWM, WDT
Product Status
Active
Supplier Device Package
367-FCBGA (15x15)
Series
-
Package / Case
367-BFBGA, FCBGA
REACH Status
REACH Unaffected
Mfr
Texas Instruments
Connectivity
CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Package
Tape & Reel (TR)
RoHS Status
ROHS3 Compliant
Primary Attributes
-
Moisture Sensitivity Level (MSL)
3 (168 Hours)
TDA3LXRBFABFQ1 Documents
Download datasheets TDA3LXRBFABFQ1
Related Parts
10AS027H2F34E2LG
Intel
10AS048E2F29I1HG
Intel
BCM85620IFSBG
Broadcom
MPFS160T-1FCVG784T2
Microchip Technology
5CSEBA5U23C7N
Intel
1SX250LU3F50I2VG
Intel
BCM58101B2KFBG
Broadcom
10AS032E2F27E1HG
Intel
1SX280LN3F43I2LPAS
Intel
M2S025TS-1VFG400
Microchip Technology
AGFC019R31C2E2V
Intel
AGFB006R16A3E3E
Intel
1SX250LH3F55E1VG
Intel
AGFB008R16A2I3V
Intel
Shopping Guide
Payment Methods
Payment_desc
Shipping Rate
Shipping_rate_desc
Delivery Methods
Delivery_Methods_desc
Home_foot.INFORMATION
Home_foot.POLICIES
Home_foot.TOOLS
Home_foot.payment
Home_foot.Transportation
Home_foot.Trademark
Home_foot.Copyright