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Texas Instruments_TDA3MDDBABFQ1
Texas Instruments_TDA3MDDBABFQ1
Texas Instruments

TDA3MDDBABFQ1

System On Chip (SoC)
Texas Instruments
TDA3MDDBABFQ1
6-TDA3MDDBABFQ1
LOW POWER SOC W/ FULL-FEATURED P
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Description Tech Specifications Documents Shopping Guide

TDA3MDDBABFQ1 Description

ARM® Cortex®-M4, C66x System On Chip (SOC) IC - 212.8MHz, 500MHz 367-FCBGA (15x15)

Tech Specifications

Core Processor
ARM® Cortex®-M4, C66x
Speed
212.8MHz, 500MHz
Operating Temperature
-40°C ~ 125°C (TJ)
Architecture
DSP, MPU
Flash Size
-
RAM Size
512kB
Number of I/O
126
Peripherals
DMA, POR, PWM, WDT
Product Status
Active
Supplier Device Package
367-FCBGA (15x15)
Series
-
Package / Case
367-BFBGA, FCBGA
REACH Status
REACH Unaffected
Mfr
Texas Instruments
Connectivity
CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Package
Tape & Reel (TR)
RoHS Status
ROHS3 Compliant
Primary Attributes
-
Moisture Sensitivity Level (MSL)
3 (168 Hours)

TDA3MDDBABFQ1 Documents

Download datasheets TDA3MDDBABFQ1

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