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Trenz Electronic
TE0813-01-3AE11-A
Microcontrollers, Microprocessor, FPGA Modules
TE0813-01-3AE11-A
8-TE0813-01-3AE11-A
MPSOC MODULE WITH XILINX ZYNQ UL
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TE0813-01-3AE11-A Description
Zynq® UltraScale+™ Series, Zynq UltraScale+ XCZU3CG-1SFVC784E, ROHS3 Compliant
Tech Specifications
Core Processor
Zynq UltraScale+ XCZU3CG-1SFVC784E
Speed
-
Operating Temperature
0°C ~ 85°C
Flash Size
128MB
RAM Size
2GB
Size / Dimension
2.990" L x 2.050" W (76.00mm x 52.00mm)
Product Status
Active
Series
Zynq® UltraScale+™
Module/Board Type
MPU Core
Co-Processor
-
Mfr
Trenz Electronic GmbH
Connector Type
Board-to-Board (BTB) Socket - 240
Package
Bulk
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
TE0813-01-3AE11-A Documents
Download datasheets TE0813-01-3AE11-A
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SOC Technologies (System-On-Chip Technologies)
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