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NXP Semiconductors
XPC850CZT50BUR2
Microprocessors
XPC850CZT50BUR2
7-XPC850CZT50BUR2
IC MPU MPC8XX 50MHZ 256BGA
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XPC850CZT50BUR2 Description
Tech Specifications
Mfr
NXP USA Inc.
Series
MPC8xx
Package
Tape & Reel (TR)
Core Processor
MPC8xx
Operating Temperature
-40°C ~ 95°C (TA)
Mounting Type
Surface Mount
Package / Case
256-BGA
Supplier Device Package
256-PBGA (23x23)
Base Product Number
XPC85
Voltage - I/O
3.3V
Speed
50MHz
Number of Cores/Bus Width
1 Core, 32-Bit
Co-Processors/DSP
Communications; CPM
RAM Controllers
DRAM
Graphics Acceleration
No
Ethernet
10Mbps (1)
USB
USB 1.x (1)
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Packaging
All Dev Label Update 15/Dec/2020
XPC850CZT50BUR2 Documents
Download datasheets XPC850CZT50BUR2
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